Paper
27 June 2019 Mask process correction for optical weak pattern improvement
Author Affiliations +
Abstract
In 14nm process critical layer, the weak pattern due to complex pattern designs will be revised aggressively by (OPC) Optical Proximity Correction. Therefore, the optical properties of these patterns will be extremely unstable. (Ex. High MEEF or Low contrast) In this circumstance, the mask process variation will impact the distribution of optical intensity for weak patterns quite considerably. In order to reduce the impact of the mask process variation, we add MPC (Mask process proximity correction) technique. Revising the mask process of ideal OPC masks again can make the result of masks meet our expectations better. In the paper, we show the comparison between the weak pattern of high MEEF with MPC and Non-MPC. We not only compare the optical behavior with the SEM Contour but also compare the variation of the real wafer process window. By means of the method in this paper, using MPC technique can definitely reduce the impact of the mask process variation and improve lithographic performance for weak pattern.
© (2019) COPYRIGHT Society of Photo-Optical Instrumentation Engineers (SPIE). Downloading of the abstract is permitted for personal use only.
Pai Chi Chen, Chain Ting Huang, Shang Feng Weng, Yung Feng Cheng, Kazunori Nagai, and Kenji Kono "Mask process correction for optical weak pattern improvement", Proc. SPIE 11178, Photomask Japan 2019: XXVI Symposium on Photomask and Next-Generation Lithography Mask Technology, 111780Q (27 June 2019); https://doi.org/10.1117/12.2535770
Advertisement
Advertisement
RIGHTS & PERMISSIONS
Get copyright permission  Get copyright permission on Copyright Marketplace
KEYWORDS
Photomasks

Optical proximity correction

Scanning electron microscopy

Bridges

Critical dimension metrology

Optical calibration

Optical simulations

RELATED CONTENT


Back to Top