'Hetero-print': A holistic approach to transfer-printing for heterogenous integration in manufacturing

Michael J. Strain

doi:10.1117/12.2584855

4 October 2020 'Hetero-print': A holistic approach to transfer-printing for heterogenous integration in manufacturing

Michael J. Strain

Proceedings Volume 11580, SPIE Photonex Industry Talks; 1158007 (2020) https://doi.org/10.1117/12.2584855
Event: SPIE Photonex and Vacuum Expo, 2020, Online Only

Abstract

In this presentation Dr Strain will outline recent research advances made under the EPSRC Programme Grant, Heteroprint. This project is developing new micro-assembly technologies for the hybrid integration of multiple materials onto single chip-scale systems. The presentation will cover important aspects of the project including nanoscale accurate transfer printing, epitaxial materials design, growth and processing, and automated measurement of large device populations. Examples of photonic devices fabricated using this hybrid integration technology in diamond, III-V and silicon materials will be presented.

Conference Presentation

Citation Download Citation

Michael J. Strain "'Hetero-print': A holistic approach to transfer-printing for heterogenous integration in manufacturing", Proc. SPIE 11580, SPIE Photonex Industry Talks, 1158007 (4 October 2020); https://doi.org/10.1117/12.2584855

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