Presentation + Paper
1 March 2021 Effect of surface temperature on GeSbTe damage formation during plasma processing
L. Buzi, J. M. Papalia, H. Miyazoe, H.-Y. Cheng, M. Hopstaken, R. L. Bruce, S. U. Engelmann
Author Affiliations +
Abstract
Phase Change Memory (PCM) materials can be damaged during plasma exposure leading to changes in phase transition behavior. Etch-induced damage and crystallization properties of GeSbTe (GST) were evaluated as a function of substrate temperature, plasma chemistry, and plasma exposure time. Enhanced damage formation is related to selective elemental depletion and non-volatilized etch residue retention in the near surface region. These experiments validate literature findings that crystallization time increases with reduction in film thickness for GST samples capped with a thin SiO2 film, indicating the presence of a modified layer which serves as an interface layer material. A direct comparison of passivating properties of hydrofluorocarbon and hydrocarbon on GST can be more conclusive with a fine tuning of film thickness and an evaluation of total residue retention with depth profiling.
Conference Presentation
© (2021) COPYRIGHT Society of Photo-Optical Instrumentation Engineers (SPIE). Downloading of the abstract is permitted for personal use only.
L. Buzi, J. M. Papalia, H. Miyazoe, H.-Y. Cheng, M. Hopstaken, R. L. Bruce, and S. U. Engelmann "Effect of surface temperature on GeSbTe damage formation during plasma processing", Proc. SPIE 11615, Advanced Etch Technology and Process Integration for Nanopatterning X, 116150G (1 March 2021); https://doi.org/10.1117/12.2581706
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KEYWORDS
Plasma

Etching

Chemistry

Applied physics

Halogens

Plasma etching

Switching

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