Stackable wafer-thin coolers for high-power laser-diode arrays

Robert E. Hendron; C. C. Becker; Joseph L. Levy; John E. Jackson

doi:10.1117/12.18271

1 May 1990 Stackable wafer-thin coolers for high-power laser-diode arrays

Robert E. Hendron, C. C. Becker, Joseph L. Levy, John E. Jackson

Proceedings Volume 1219, Laser Diode Technology and Applications II; (1990) https://doi.org/10.1117/12.18271
Event: OE/LASE '90, 1990, Los Angeles, CA, United States

Abstract

An advanced cooling technique has been developed to remove very high heat flux levels from two-dimensional arrays of GaAs laser diode bars using stackable wafer thin coolers. The thermal performance of these coolers is expected to surpass previous versions, and a unique sealing technique has been designed to allow these coolers to be packaged in a very compact arrangement. The cooler design and fabrication, coolant manifold and sealing, and test procedure are described.

Citation Download Citation

Robert E. Hendron, C. C. Becker, Joseph L. Levy, and John E. Jackson "Stackable wafer-thin coolers for high-power laser-diode arrays", Proc. SPIE 1219, Laser Diode Technology and Applications II, (1 May 1990); https://doi.org/10.1117/12.18271

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