Electronic ceramic substrates have been widely used in various markets, which include the automotive industry, electronics, aviation, and sensor due to their good thermal conductivity and thermal stability. The holes in ceramic substrates are very important for their application, many techniques are studied to drill holes of different sizes. This research presents the results of UV ultrashort pulse laser drilling of ceramic substrates with different laser parameters. Normally, the ultrashort pulse laser can be used to process materials due to its less heat-affected zone, so the heat-affected zone of the hole is also observed around the laser-drilled holes.
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