Tailored-edge laser glass cleaving supported by thermal separation

Myriam Kaiser; Max Kahmann; Jonas Kleiner; Daniel Flamm

doi:10.1117/12.2649794

17 March 2023 Tailored-edge laser glass cleaving supported by thermal separation

Myriam Kaiser, Max Kahmann, Jonas Kleiner, Daniel Flamm

Proceedings Volume 12408, Laser Applications in Microelectronic and Optoelectronic Manufacturing (LAMOM) XXVIII; 124080C (2023) https://doi.org/10.1117/12.2649794
Event: SPIE LASE, 2023, San Francisco, California, United States

Abstract

A two-step laser-based concept is presented for cleaving glass substrates with tailored edges. In a first step beam shaped ultrashort laser pulses are used to modify the transparent material along chamfered or C-shaped edges. Secondly, thermal stress is applied close to the modified area by absorbing the radiation from CO₂ laser. The tensile stress thus induced on the upper side of the glass leads to the actual release. The efficacy of our approach is demonstrated by presenting selected samples with tailored shaped edges and discussing corresponding edge qualities.

Conference Presentation

Citation Download Citation

Myriam Kaiser, Max Kahmann, Jonas Kleiner, and Daniel Flamm "Tailored-edge laser glass cleaving supported by thermal separation", Proc. SPIE 12408, Laser Applications in Microelectronic and Optoelectronic Manufacturing (LAMOM) XXVIII, 124080C (17 March 2023); https://doi.org/10.1117/12.2649794

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