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We report the gate leakage current and threshold voltage characteristics of Al0.3Ga0.7N/GaN heterojunction field effect transistor (HFET) with metal-organic chemical vapor deposition (MOCVD) grown β-Ga2O3 as a gate dielectric for the first time. In this study, GaN channel HFET and β-Ga2O3 passivated metal-oxide-semiconductor-HFET (MOS-HFET) structures were grown in MOCVD using N2 as carrier gas on a sapphire substrate. X-ray diffraction (XRD) and atomic force microscopy (AFM) were used to characterize the structural properties and surface morphology of the heterostructure. The electrical properties were analyzed using van der Pauw, Hall, and the mercury probe capacitance-voltage (C-V) measurement systems. The 2-dimensional electron gas (2DEG) carrier density for the heterostructure was found to be in the order of ~1013 cm-2. The threshold voltage shifted more towards the negative side for the MOSHFET. The high-low (Hi-Lo) frequency-based C-V method was used to calculate the interface charge density for the oxide-AlGaN interface and was found to be in the order of ~1012 cm2eV-1. A remarkable reduction in leakage current from 2.33×10-2 A/cm2 for HFET to 1.03×10-8 A/cm2 for MOSHFET was observed demonstrating the viability of MOCVD-grown Ga2O3 as a gate dielectric.
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Samiul Hasan, Mohi Uddin Jewel, Scott R. Crittenden, Dongkyu Lee, Vitaliy S. Avrutin, Ümit Özgür, Hadis Morkoç, Iftikhar Ahmad, "Gate leakage current and threshold voltage characteristics of β-Ga2O3 passivated AlGaN/GaN based heterojunction field effect transistor," Proc. SPIE 12421, Gallium Nitride Materials and Devices XVIII, 124210A (15 March 2023); https://doi.org/10.1117/12.2668236