Presentation + Paper
30 April 2023 Chitosan as a water-based photoresist for DUV lithography
Author Affiliations +
Abstract
DUV photolithography, as the major process of nanofabrication, typically requires high volumes of toxic chemicals within resist formulation, solvent and developer. In this context, alternative chemistries to current petroleum-derived photoresists are proposed to reduce environmental impacts. Chitosan represents a bio-sourced resist allowing water-based patterning processes free of organic solvent and alkali-based developers, by substitution with a green solvent (deionized (DI) water). This paper present last stepwise process in the patterning integration with a chitosan-based resist. Preliminary results using a 300 mm pilot line scale at CEA-Leti demonstrate patterns resolution down to 800 nm along with plasma etch transfer into Si substrate. Finally, the environmental impact through life cycle analysis (LCA) of the whole process based on chitosan resist is assessed and compared to conventional solvent-based processes.
Conference Presentation
© (2023) COPYRIGHT Society of Photo-Optical Instrumentation Engineers (SPIE). Downloading of the abstract is permitted for personal use only.
Isabelle Servin, Alexandre Teolis, Arnaud Bazin, Aurélien Sarrazin, Paule Durin, Olha Sysova, Corinne Gablin, Benoît Saudet, Didier Leonard, Olivier Soppera, Jean-Louis Leclercq, Yann Chevolot, Raluca Tiron, Thierry Delair, and Stephane Trombotto "Chitosan as a water-based photoresist for DUV lithography", Proc. SPIE 12498, Advances in Patterning Materials and Processes XL, 1249818 (30 April 2023); https://doi.org/10.1117/12.2658423
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KEYWORDS
Semiconducting wafers

Silicon

Deep ultraviolet

Lithography

Photoacid generators

Photoresist processing

Plasma etching

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