Presentation + Paper
1 May 2023 Advances in low GWP etch gasses
Colin Jennings, Phong Nguyen, Scott Biltek, Nathan Stafford
Author Affiliations +
Abstract
Fluorinated species are ubiquitous in semiconductor manufacturing, yet are known to have global warming potentials thousands of times higher than CO2. As abatement technologies are not completely effective and add additional costs, interest in reducing these emissions increases with semiconductor manufacturing volumes. We explore alternative chemistries for common plasma etch applications that retain patterning performance but with near zero GWP. Spectroscopic identification and quantification of etch byproducts is presented to demonstrate the beneficial environmental impacts of transitioning from the most common etch gasses.
Conference Presentation
© (2023) COPYRIGHT Society of Photo-Optical Instrumentation Engineers (SPIE). Downloading of the abstract is permitted for personal use only.
Colin Jennings, Phong Nguyen, Scott Biltek, and Nathan Stafford "Advances in low GWP etch gasses", Proc. SPIE 12499, Advanced Etch Technology and Process Integration for Nanopatterning XII, 124990G (1 May 2023); https://doi.org/10.1117/12.2660136
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KEYWORDS
Etching

Gases

Plasma etching

Chemistry

Climate change

Vacuum chambers

Plasma

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