Laser marking micro ID for wafer identification

Lingling Zhang; Tianjiao Shu; Guoqi Li; Yuanchao Du; Yuan Chen; Jie Zhang

doi:10.1117/12.2656633

16 December 2022 Laser marking micro ID for wafer identification

Lingling Zhang, Tianjiao Shu, Guoqi Li, Yuanchao Du, Yuan Chen, Jie Zhang

Author Affiliations +

Proceedings Volume 12501, Seventeenth National Conference on Laser Technology and Optoelectronics; 125011D (2022) https://doi.org/10.1117/12.2656633
Event: Seventeenth National Conference on Laser Technology and Optoelectronics, 2022, Shanghai, China

Abstract

In this paper, in order to identify and trace the single silicon wafer, the robustness of wafer identification using micro ID on polished silicon wafers is investigated. A dot-matrix encoding scheme for forming reliable, machine-readable identifying codes on the wafer is used. The quality of dot concerning marking depth, the dot size, robustness of code detection by automatic vision inspection is investigated. The topography and the depth, the dot size are evaluated with VHX6000 microscope and Bruker Contour GT 3D Surface Profiler. Codes either alphanumeric characters or data matrix codes with different the topography and the depth are detected by the In-Sight 1741 image Code Reader. Dot diameter ranges from 15.4 to 70um and dot depth ranging from 0.287um to 3.797 um are achieved. The minimum readable Data Matrix codes is 2.33*0.53mm,the average read rates of 100% are already achieved with the Data Matrix codes With 3.88*0.65mm.

Citation Download Citation

Lingling Zhang, Tianjiao Shu, Guoqi Li, Yuanchao Du, Yuan Chen, and Jie Zhang "Laser marking micro ID for wafer identification", Proc. SPIE 12501, Seventeenth National Conference on Laser Technology and Optoelectronics, 125011D (16 December 2022); https://doi.org/10.1117/12.2656633

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