Characterization of a new inspection system

Jean-Luc Jacquot; Michel Darboux; Bernard Picard; Manouk Kuradjian

doi:10.1117/12.20045

1 June 1990 Characterization of a new inspection system

Jean-Luc Jacquot, Michel Darboux, Bernard Picard, Manouk Kuradjian

Proceedings Volume 1261, Integrated Circuit Metrology, Inspection, and Process Control IV; (1990) https://doi.org/10.1117/12.20045
Event: Microlithography '90, 1990, San Jose, CA, United States

Abstract

This paper presents a fully automated inspection system answering to the growing need of in-process wafer control After a brief description of the mechanical, optical and image processing parts, we sum up our inspection method based on a robust and fast image comparison . One image is obtained directly from the die to inspect through an optical microscope . The other one may be: - the corresponding site on the neighbouring die ( die to die strategy) - areference image extracted from aleamed defect free library ( die to reference strategy) - a synthesized image from the CAD database ( die to database strategy) We give then some results for three functions of this system: - reticlequalification - defect density measurement on patterned wafers - control of die critical sites Defect localisations are memorized, and an interactive reviewing software allows to observe these defects with various optical conditions (magnification, wavelength, focus...).

Citation Download Citation

Jean-Luc Jacquot, Michel Darboux, Bernard Picard, and Manouk Kuradjian "Characterization of a new inspection system", Proc. SPIE 1261, Integrated Circuit Metrology, Inspection, and Process Control IV, (1 June 1990); https://doi.org/10.1117/12.20045

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