Sidewall profile control through processing and dye additives

Eitan Shalom; Donald W. Johnson; Kelly Hale; Terry Pebbles; William B. Curtis

doi:10.1117/12.20115

1 June 1990 Sidewall profile control through processing and dye additives

Eitan Shalom, Donald W. Johnson, Kelly Hale, Terry Pebbles, William B. Curtis

Author Affiliations +

Proceedings Volume 1262, Advances in Resist Technology and Processing VII; (1990) https://doi.org/10.1117/12.20115
Event: Microlithography '90, 1990, San Jose, CA, United States

Abstract

This paper studies e effects of process conditions and dye additives on sidewall profiles using RS—1 designed experiments. We have explored the mechanism of forming negative sidewall profiles (above 90) in a positive photoresist, the dependence of depth of focus (DOF) and exposure latitude upon sidewall angle The resist studied is a positive, dual purpose (g—, i—line) resist, ULTRAMAC EL2015. The study presented in this paper was done in i—line but similar phenomena were observed in g—line as well. The effect of two different actirtic dyes in various concentrations on wall angle control is demonstrated. The two dyes investigated are both soluble in resist solvent but their solubility in developer is very different and their effect on required exposure energy is different. The contribution of the dyes to the absorption of the resist, their effect on swing curve and surface inhibition is evaluated and compared. The surface inhibition effect of undyed resist has been determined to be the most critical parameter influencing profiles, as increased post exposure bake temperature increases sidewall profile angle.

Citation Download Citation

Eitan Shalom, Donald W. Johnson, Kelly Hale, Terry Pebbles, and William B. Curtis "Sidewall profile control through processing and dye additives", Proc. SPIE 1262, Advances in Resist Technology and Processing VII, (1 June 1990); https://doi.org/10.1117/12.20115

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