Paper
8 June 2023 Research on dimension measurement technology based on machine vision
Mingyao Liu, Shengshi Mao
Author Affiliations +
Proceedings Volume 12707, International Conference on Image, Signal Processing, and Pattern Recognition (ISPP 2023); 127072U (2023) https://doi.org/10.1117/12.2681077
Event: International Conference on Image, Signal Processing, and Pattern Recognition (ISPP 2023), 2023, Changsha, China
Abstract
For mechanical dimension detection of Printed Circuit Board (PCB), an image feature recognition method based on location relationship was proposed. Select a standard PCB standard graph as the standard graph, establish a template for image matching in the standard graph, and determine the measurement area, measurement type, standard size and tolerance. Through template matching of test points in PCB test, comparing different types of test characteristics, selecting appropriate image feature extraction and identification, comparing standard size and tolerance, so as to determine the quality of PCB. This paper introduces a fast and efficient automatic test technology based on PCB test requirement.
© (2023) COPYRIGHT Society of Photo-Optical Instrumentation Engineers (SPIE). Downloading of the abstract is permitted for personal use only.
Mingyao Liu and Shengshi Mao "Research on dimension measurement technology based on machine vision", Proc. SPIE 12707, International Conference on Image, Signal Processing, and Pattern Recognition (ISPP 2023), 127072U (8 June 2023); https://doi.org/10.1117/12.2681077
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KEYWORDS
Cameras

Image acquisition

Standards development

Feature extraction

Machine vision

Tolerancing

Industry

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