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Advanced computational lithography requires growing compute power and increased flexibility which can be easily accessed on Cloud. We’ll present solutions developed to allow Calibre semiconductor manufacturing PTOF jobs to leverage Cloud massive compute power seamlessly and cost-effectively. An OPC–MPC–MDP PTOF flow launched under Siemens EDA Reference Environment for AWS will demonstrate the following optimizations: keep Cloud instances busy and provide best runtime by dynamically scaling the jobs and the cluster size; use AWS spot instances seamlessly; monitor jobs and hardware at the same time to fine-tune cloud instance types; reach massive scalability using Calibre FullScale.
Conference Presentation
(2024) Published by SPIE. Downloading of the abstract is permitted for personal use only.
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Pascal Gilgenkrantz, Bassem Riad, Maram Salah, Azim Siddique, "Cloud flight plan for post-tapeout flow jobs," Proc. SPIE 12954, DTCO and Computational Patterning III, 129540O (10 April 2024); https://doi.org/10.1117/12.3010142