Advancements in metrology for advanced semiconductor packaging

Wei-Hsin Chein; Gaurav Pandey; Surajit Das; Liang-Chia Chen

doi:10.1117/12.3024745

18 June 2024 Advancements in metrology for advanced semiconductor packaging

Wei-Hsin Chein, Gaurav Pandey, Surajit Das, Liang-Chia Chen

Proceedings Volume 12997, Optics and Photonics for Advanced Dimensional Metrology III; 129970R (2024) https://doi.org/10.1117/12.3024745
Event: SPIE Photonics Europe, 2024, Strasbourg, France

Abstract

In the wake of continuous miniaturization, optical metrology has solidified its role as an essential instrument in semiconductor manufacturing, chiefly due to its non-invasive, high-precision, and rapid measurement capacities. Particularly crucial in advanced techniques such as automated optical inspection (AOI), its significance grows with the rising demand for accurate 3D integrated circuit packaging characterization. This introduces notable challenges for optical metrology, which need addressing to meet rigorous in-line process demands. This talk aims to present an overview of key measurement methods in semiconductor fabrication, encompassing CD-SEM, X-ray or EUV scatterometry, reflectometry for optical critical dimension (OCD) metrology, AFM, advanced optics, and white light interferometry. The talk will share insights into the intrinsic limitations of these techniques, potential future innovations, and recent advancements in optical metrology. The session will conclude with a perspective on the evolution of these techniques amidst the prevailing technological constraints.

Conference Presentation

(2024) Published by SPIE. Downloading of the abstract is permitted for personal use only.

Citation Download Citation

Wei-Hsin Chein, Gaurav Pandey, Surajit Das, and Liang-Chia Chen "Advancements in metrology for advanced semiconductor packaging", Proc. SPIE 12997, Optics and Photonics for Advanced Dimensional Metrology III, 129970R (18 June 2024); https://doi.org/10.1117/12.3024745

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