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28 February 2024 A life prediction method for electronic components based on dual-channel multimodal convolutional networks
Zhen Gu, Jingyue Zhang, Chenchen Yong, Lei Zhou, Wei Xu
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Proceedings Volume 13071, International Conference on Mechatronic Engineering and Artificial Intelligence (MEAI 2023); 130713V (2024) https://doi.org/10.1117/12.3025481
Event: International Conference on Mechatronic Engineering and Artificial Intelligence (MEAI 2023), 2023, Shenyang, China
Abstract
Due to the multiple factors that affect the lifespan of electronic components, it is difficult to accurately predict the lifespan of electronic components by directly analyzing a single factor. Therefore, a study on the lifespan prediction method of electronic components based on dual channel multimodal convolutional networks is proposed. Based on the failure mechanism of electronic components, degradation models of electronic component electrical characteristic parameters were constructed from the perspectives of resistance and capacitance. Two parallel convolutional channels are used to extract continuous samples with uniform sampling time intervals. The degradation characteristics of electronic component electrical characteristic parameters at different time points extracted by the two parallel convolutional channels are fused, so that the final extracted electronic component features have temporal information. Multimodal fitting is performed on the electronic component features at the output of the convolutional network to obtain the final life prediction result. In the test results, the prediction error of the design method is stable within 6.0%, the time cost is stable within 21.0s, and fast convergence can be achieved.
(2024) Published by SPIE. Downloading of the abstract is permitted for personal use only.
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Zhen Gu, Jingyue Zhang, Chenchen Yong, Lei Zhou, and Wei Xu "A life prediction method for electronic components based on dual-channel multimodal convolutional networks", Proc. SPIE 13071, International Conference on Mechatronic Engineering and Artificial Intelligence (MEAI 2023), 130713V (28 February 2024); https://doi.org/10.1117/12.3025481
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KEYWORDS
Electronic components
Feature extraction
Resistors
Capacitors
Resistance
Failure analysis
Error analysis
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