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1 April 2024 The influence of adhesive bonding process parameters on the stability of mechanical structures and parameter optimization
Xiaotian Guo, Xin Jin, Xiao Chen, Jian Xiong, Chaojiang Li, Zhijing Zhang
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Proceedings Volume 13081, Third International Conference on Advanced Manufacturing Technology and Electronic Information (AMTEI 2023); 1308108 (2024) https://doi.org/10.1117/12.3025838
Event: 2023 3rd International Conference on Advanced Manufacturing Technology and Electronic Information (AMTEI 2023), 2023, Tianjin, China
Abstract
The adhesive bonding structure is widely used in mechanical structure assembly due to its high connection reliability, low assembly stress, good vibration damping and insulation performance. In the case of large temperature coverage and longterm continuous operation, the creep of adhesive bonding structure is the core factor affecting the stability of mechanical structure. Through experimental testing, an accurate adhesive material parameter constitutive model covering the operating temperature range is constructed. On this basis, the adhesive bonding structure in a certain type of accelerometer is selected for research. Through finite element simulation analysis of the structural creep of the adhesive bonding structure, a finite element simulation model of the creep characteristics of the adhesive bonding structure under the coupling of temperature and magnetic fields is established. The influence law of adhesive process parameters on the stability of mechanical structure at different temperatures is obtained. Finally, based on the response surface method, the adhesive process parameters are optimized and the optimized specific adhesive process parameters are obtained. This article proposes a process method that can effectively improve the stability of mechanical structure, providing a theoretical basis for guiding the formulation and optimization of adhesive bonding process in precision mechanical products.
(2024) Published by SPIE. Downloading of the abstract is permitted for personal use only.
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Xiaotian Guo, Xin Jin, Xiao Chen, Jian Xiong, Chaojiang Li, and Zhijing Zhang "The influence of adhesive bonding process parameters on the stability of mechanical structures and parameter optimization", Proc. SPIE 13081, Third International Conference on Advanced Manufacturing Technology and Electronic Information (AMTEI 2023), 1308108 (1 April 2024); https://doi.org/10.1117/12.3025838
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KEYWORDS
Adhesives
Deformation
Accelerometers
Temperature metrology
Mathematical optimization
Thermal stability
Analytical research
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