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10 December 2024 An efficient way towards massive CD-SEM metrology recipes based on line scan analysis: release your hands
Zhiping Mou, Kun Ren, Dawei Gao, Shibin Xu, Yanjiang Li, Chenwei Sun, Bo Pang
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Proceedings Volume 13423, Eighth International Workshop on Advanced Patterning Solutions (IWAPS 2024); 1342307 (2024) https://doi.org/10.1117/12.3052328
Event: 8th International Workshop on Advanced Patterning Solutions (IWAPS 2024), 2024, Jiaxing, Zhejiang, China
Abstract
In IC manufacturing, there is a great demand for CD-SEM image production in the areas of computational lithography, hotspot detection, yield improvement, etc. Whereas, directing CD-SEM metrology is time-cost and skillfulness since it requires metrology engineers to manage creating CD-SEM recipes on their experience gauge by gauge, including determining suitable metrology methods, corresponding parameters, optimal Auto Focus and Addressing position based on shapes and circumstances of the metrology target. To address this, this work has proposed an efficient and labor-free way to create CD-SEM recipes via a High-Speed-Steaming (HSS) file in Recipe Director to measure lots of points within minutes automatically. For each metrology position, its numerical geometry feature obtained in Line Scan analysis achieves the ability of measurement type determining and relative parameters returning. Autofocus and Addressing position searching can be well done with sliding window patches and Fourier descriptors in the meanwhile. With an aim to facilitate massive gauge measurements and convenient usage, a Windows-platform software is also developed for engineers.
(2024) Published by SPIE. Downloading of the abstract is permitted for personal use only.
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Zhiping Mou, Kun Ren, Dawei Gao, Shibin Xu, Yanjiang Li, Chenwei Sun, and Bo Pang "An efficient way towards massive CD-SEM metrology recipes based on line scan analysis: release your hands", Proc. SPIE 13423, Eighth International Workshop on Advanced Patterning Solutions (IWAPS 2024), 1342307 (10 December 2024); https://doi.org/10.1117/12.3052328
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KEYWORDS
Windows
Metrology
Scanning electron microscopy
Optical alignment
Feature extraction
Line scan image sensors
Manufacturing
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