SEM contour extraction application on OPC model of contact layer

Xinyuan Zhang; Miaohong Yao; Shibin Xu; Zheju Yan; Kun Ren; Yongyu Wu; Dawei Gao; Ken Chen; Xiangshang Zhu; Chenwei Sun; Feng Shao

doi:10.1117/12.3052691

10 December 2024 SEM contour extraction application on OPC model of contact layer

Xinyuan Zhang, Miaohong Yao, Shibin Xu, Zheju Yan, Kun Ren, Yongyu Wu, Dawei Gao, Ken Chen, Xiangshang Zhu, Chenwei Sun, Feng Shao

Author Affiliations +

Proceedings Volume 13423, Eighth International Workshop on Advanced Patterning Solutions (IWAPS 2024); 134230E (2024) https://doi.org/10.1117/12.3052691
Event: 8th International Workshop on Advanced Patterning Solutions (IWAPS 2024), 2024, Jiaxing, Zhejiang, China

Abstract

There are many kinds of OPC test pattern in Contact (CT) layer, and different measurement methods are used to measure the model data, resulting in a large simulation error of y-direction rectangle type patterns in the model. We propose a new method to build OPC model of CT layer by using SEM image contour. In this work, the SEM image contour was extracted by Calibre SEMSuite™, and the measurements of the corresponding test pattern was calculated according to the image contour. The CD-SEM (critical dimension scanning electron microscope) measurement data of anchor point was used to calibrate the modeling data and then the OPC model was built. Compared with the model tuned by CD measurements, the simulation error of y-direction rectangle type patterns caused by measurement method is effectively reduced. Our experiments show that it is feasible to build a high precision OPC model of CT layer by using this method.

(2024) Published by SPIE. Downloading of the abstract is permitted for personal use only.

Citation Download Citation

Xinyuan Zhang, Miaohong Yao, Shibin Xu, Zheju Yan, Kun Ren, Yongyu Wu, Dawei Gao, Ken Chen, Xiangshang Zhu, Chenwei Sun, and Feng Shao "SEM contour extraction application on OPC model of contact layer", Proc. SPIE 13423, Eighth International Workshop on Advanced Patterning Solutions (IWAPS 2024), 134230E (10 December 2024); https://doi.org/10.1117/12.3052691

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