Research on wafer warping monitoring based on digital twin

Pingyu Zhu; Hengzhen Liu; Fumin Xie

doi:10.1117/12.3055454

12 December 2024 Research on wafer warping monitoring based on digital twin

Pingyu Zhu, Hengzhen Liu, Fumin Xie

Author Affiliations +

Proceedings Volume 13439, Fourth International Conference on Testing Technology and Automation Engineering (TTAE 2024); 134391B (2024) https://doi.org/10.1117/12.3055454
Event: Fourth International Conference on Testing Technology and Automation Engineering (TTAE 2024), 2024, Xiamen, China

Abstract

In order to solve the problem of real-time synchronous display of wafer warping monitoring, a wafer warping monitoring method based on DTing is proposed to realize the interactive symbiosis of wafer physical space and virtual space. The wafer warping monitoring system based on the five-dimensional DT model is constructed, including digital space construction, MCC-DT data drive, twin data transmission and management, and service system. The physical wafer warping is simulated by displacement loading, and the virtual wafer warping is obtained synchronously by the established twin system. The experimental results show that the accuracy of the proposed system can reach 90%, and provide help for wafer digital manufacturing.

(2024) Published by SPIE. Downloading of the abstract is permitted for personal use only.

Citation Download Citation

Pingyu Zhu, Hengzhen Liu, and Fumin Xie "Research on wafer warping monitoring based on digital twin", Proc. SPIE 13439, Fourth International Conference on Testing Technology and Automation Engineering (TTAE 2024), 134391B (12 December 2024); https://doi.org/10.1117/12.3055454

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