Paper
11 December 2024 Position measurement of target alignment based on 3D depth camera
Chaoqun Wang, Kuan Li, Hengjin Ma
Author Affiliations +
Proceedings Volume 13445, International Conference on Electronics, Electrical and Information Engineering (ICEEIE 2024); 1344524 (2024) https://doi.org/10.1117/12.3054436
Event: International Conference on Electronics. Electrical and Information Engineering (ICEEIE 2024), 2024, Haikou, China
Abstract
To address the issue of manual observation for aligning operations during the loading of the large target, a 3D depth camera was used to measure the position of the alignment target. The recognition of the alignment target is completed by selecting the fixed threshold algorithm and the contour-based minimum enclosing circle recognition algorithm in the position measurement process, and the measurement of the target position is realized by three-dimensional coordinate stereo solution. The experimental results indicate that the error range of position measurement after function fitting is within ±1mm. This meets the requirements for automatic alignment during the loading process of the large target.
(2024) Published by SPIE. Downloading of the abstract is permitted for personal use only.
Chaoqun Wang, Kuan Li, and Hengjin Ma "Position measurement of target alignment based on 3D depth camera", Proc. SPIE 13445, International Conference on Electronics, Electrical and Information Engineering (ICEEIE 2024), 1344524 (11 December 2024); https://doi.org/10.1117/12.3054436
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KEYWORDS
Cameras

Detection and tracking algorithms

Metals

Target recognition

Stereoscopic cameras

3D acquisition

RGB color model

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