Temperature-cycle-induced chip surface damage in lead-on-chip packages

Masazumi Amagai

doi:10.1117/12.186765

14 September 1994 Temperature-cycle-induced chip surface damage in lead-on-chip packages

Masazumi Amagai

Proceedings Volume 2334, Microelectronics Manufacturability, Yield, and Reliability; (1994) https://doi.org/10.1117/12.186765
Event: Microelectronic Manufacturing, 1994, Austin, TX, United States

Abstract

In lead-on-chip (LOC) packaging technology, the lead fingers are auached directly to the surface of the chip using a double-side adhesive tape. This method of chip attachment naturally leads to concerns about stress on the polyimide coated chip surface. Device failure related to fracture in the passivation layers and the Al-Si metal has been observed in temperature cycle tests. To investigate the effect of material characterization on the surface damage, devices were fabricated with different types of molding compounds, tapes and polyimides. This paper describes the optimum material properties, the assembly process parameters, and the experimental and simulated results of the surface damage. Keywords: surface damage, LOC package, polyimide, tape, mold compound, simulation

Citation Download Citation

Masazumi Amagai "Temperature-cycle-induced chip surface damage in lead-on-chip packages", Proc. SPIE 2334, Microelectronics Manufacturability, Yield, and Reliability, (14 September 1994); https://doi.org/10.1117/12.186765

ACCESS THE FULL ARTICLE

INSTITUTIONAL
Select your institution to access the SPIE Digital Library.

SELECT YOUR INSTITUTION

PERSONAL
Sign in with your SPIE account to access your personal subscriptions or to use specific features such as save to my library, sign up for alerts, save searches, etc.

PERSONAL SIGN IN

No SPIE Account? Create one

PURCHASE THIS CONTENT

SUBSCRIBE TO DIGITAL LIBRARY

50 downloads per 1-year subscription

Members: $195

Non-members: $335 ADD TO CART

25 downloads per 1 - year subscription

Members: $145

Non-members: $250 ADD TO CART

PURCHASE SINGLE ARTICLE

Includes PDF, HTML & Video, when available