Packaging of photonic devices using laser welding

Soon Jang

doi:10.1117/12.230077

15 January 1996 Packaging of photonic devices using laser welding

Soon Jang

Proceedings Volume 2610, Laser Diode Chip and Packaging Technology; (1996) https://doi.org/10.1117/12.230077
Event: Photonics East '95, 1995, Philadelphia, PA, United States

Abstract

Pulsed laser welding has proven to be the preferred bonding method that best facilitates the automated fiber alignment and bonding process of optoelectronic devices. However, a combination of considerations regarding (1) the high capital investment for a laser welding workstation (LWWS), (2) acquiring and developing the packaging technology for laser welding, and (3) the undeveloped demand in the market place have caused hesitation by many manufacturers in adopting the process. Typically, the majority of packages manufactured with laser welding have been higher-end priced devices. Further understanding and improvement of technical challenges, such as 'post-weld-shift' control, material selection, and package design, along with development of a cost-effective semi-automated LWWS are presenting a greater opportunity for a broader range of packages to be designed for laser welding, especially for low-cost singlemode datacom packages. The focus of the current work is to design a broad range of OE packages and develop a nanometer precision automation process for laser welding technology. The solution is recognized to be the combination of understanding the laser welding process, designing packages for laser welding, and developing an automation capability for manufacturing.

Citation Download Citation

Soon Jang "Packaging of photonic devices using laser welding", Proc. SPIE 2610, Laser Diode Chip and Packaging Technology, (15 January 1996); https://doi.org/10.1117/12.230077

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