Defect analysis with black beam interferometry

Gregory Toker; Andrei Brunfeld

doi:10.1117/12.235346

11 March 1996 Defect analysis with black beam interferometry

Gregory Toker, Andrei Brunfeld

Proceedings Volume 2651, Liquid Crystal Materials, Devices, and Applications IV; (1996) https://doi.org/10.1117/12.235346
Event: Electronic Imaging: Science and Technology, 1996, San Jose, CA, United States

Abstract

The method of Black Beam^R Interferometry, which was developed for inspection of glass substrates in LCD manufacturing, is extended in order to achieve a detailed description and classification of defects and other features on the surface under inspection. With a properly arranged detection system, not only a high defect detectability is provided, but also the ability to discriminate between the up or down defects (bumps or pits) in addition to the possibility of measuring the defect geometry (for large defects or structures) and the equivalent defect volume. The method is described and the results of simulations and experiments are presented.

Citation Download Citation

Gregory Toker and Andrei Brunfeld "Defect analysis with black beam interferometry", Proc. SPIE 2651, Liquid Crystal Materials, Devices, and Applications IV, (11 March 1996); https://doi.org/10.1117/12.235346

ACCESS THE FULL ARTICLE

INSTITUTIONAL
Select your institution to access the SPIE Digital Library.

SELECT YOUR INSTITUTION

PERSONAL
Sign in with your SPIE account to access your personal subscriptions or to use specific features such as save to my library, sign up for alerts, save searches, etc.

PERSONAL SIGN IN

No SPIE Account? Create one

PURCHASE THIS CONTENT

SUBSCRIBE TO DIGITAL LIBRARY

50 downloads per 1-year subscription

Members: $195

Non-members: $335 ADD TO CART

25 downloads per 1 - year subscription

Members: $145

Non-members: $250 ADD TO CART

PURCHASE SINGLE ARTICLE

Includes PDF, HTML & Video, when available