Thermal considerations of free-space optical interconnects using VCSEL-based smart pixel arrays

John A. Neff

doi:10.1117/12.236917

29 March 1996 Thermal considerations of free-space optical interconnects using VCSEL-based smart pixel arrays

John A. Neff

Proceedings Volume 2691, Optoelectronic Packaging; (1996) https://doi.org/10.1117/12.236917
Event: Photonics West '96, 1996, San Jose, CA, United States

Abstract

This paper discusses free-space optical interconnects from four perspectives: need, system architectures, major enabling technology, and component and system packaging. The need for such interconnection in telecommunication/datacommunication switching networks and fine- grained parallel computers is described. Since most of the envisioned systems fall into the two architectural classes of optical backplanes and 3-D systems, the paper describes these classes in detail. And the reader is introduced to the major enabling technology of smart pixel arrays. Finally, the paper describes attempts to implement free-space optical interconnect systems and some of the interesting thermal management issues that these implementations raise.

Citation Download Citation

John A. Neff "Thermal considerations of free-space optical interconnects using VCSEL-based smart pixel arrays", Proc. SPIE 2691, Optoelectronic Packaging, (29 March 1996); https://doi.org/10.1117/12.236917

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