Integration of MUMPS and electronics for system prototyping

Karen W. Markus; Vijayakumar R. Dhuler; Ramu Mahadevan; Allen Cowen; A. Shishkoff

doi:10.1117/12.240435

20 May 1996 Integration of MUMPS and electronics for system prototyping

Karen W. Markus, Vijayakumar R. Dhuler, Ramu Mahadevan, Allen Cowen, A. Shishkoff

Proceedings Volume 2722, Smart Structures and Materials 1996: Smart Electronics and MEMS; (1996) https://doi.org/10.1117/12.240435
Event: 1996 Symposium on Smart Structures and Materials, 1996, San Diego, CA, United States

Abstract

In order to create true Smart MEMS systems, the integration of electronics with the MEMS devices is essential. There are currently three methods of integration available: monolithic integration, flip chip attachment and hybrid assembly. The use of flip chip attachment for Smart MEMS has previously been described, and is now available as part of the ARPA- supported MEMS infrastructure programs MUMPs and TechNet. This paper will describe the electromechanical control system chip and the method of using it in conjunction with MUMPs to develop Smart MEMS prototypes.

Citation Download Citation

Karen W. Markus, Vijayakumar R. Dhuler, Ramu Mahadevan, Allen Cowen, and A. Shishkoff "Integration of MUMPS and electronics for system prototyping", Proc. SPIE 2722, Smart Structures and Materials 1996: Smart Electronics and MEMS, (20 May 1996); https://doi.org/10.1117/12.240435

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