Advanced micromechanisms in a multilevel polysilicon technology

M. Steven Rodgers; Jeffry J. Sniegowski; Samuel L. Miller; Carole Craig Barron; Paul J. McWhorter

doi:10.1117/12.284507

5 September 1997 Advanced micromechanisms in a multilevel polysilicon technology

M. Steven Rodgers, Jeffry J. Sniegowski, Samuel L. Miller, Carole Craig Barron, Paul J. McWhorter

Proceedings Volume 3224, Micromachined Devices and Components III; (1997) https://doi.org/10.1117/12.284507
Event: Micromachining and Microfabrication, 1997, Austin, TX, United States

Abstract

Quad-level polysilicon surface micromachining technology, comprising three mechanical levels plus an electrical interconnect layer, is giving rise to a new generation of micro-electromechanical devices and assemblies. Enhanced components can now be produced through greater flexibility in fabrication and design. New levels of design complexity that include multi-level gears, single-attempt locks, and optical elements have recently been realized. Extensive utilization of the fourth layer of polysilicon differentiates these latter generation devices from their predecessors. This level of poly enables the fabrication of pin joints, linkage arms, hinges on moveable plates, and multi-level gear assemblies. The mechanical design aspects of these latest micromachines will be discussed with particular emphasis on a number of design modifications that improve the power, reliability, and smoothness of operation of the microengine. The microengine is the primary actuation mechanism that is being used to drive mirrors out of plane and rotate 1600-micrometers diameter gears. Also discussed is our most advanced micromechanical system to date, a complex proof-of-concept batch-fabricated assembly that, upon transmitting the proper electrical code to a mechanical lock, permits the operation of a micro-optical shutter.

Citation Download Citation

M. Steven Rodgers, Jeffry J. Sniegowski, Samuel L. Miller, Carole Craig Barron, and Paul J. McWhorter "Advanced micromechanisms in a multilevel polysilicon technology", Proc. SPIE 3224, Micromachined Devices and Components III, (5 September 1997); https://doi.org/10.1117/12.284507

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