Process characterization of 100-um-thick photoresist films

Warren W. Flack; Sylvia White; Bradley Todd

doi:10.1117/12.350230

11 June 1999 Process characterization of 100-μm-thick photoresist films

Warren W. Flack, Sylvia White, Bradley Todd

Proceedings Volume 3678, Advances in Resist Technology and Processing XVI; (1999) https://doi.org/10.1117/12.350230
Event: Microlithography '99, 1999, Santa Clara, CA, United States

Abstract

The number of lithographic applications that require the use of photoresist thickness of one hundred microns or more is rapidly increasing. Extremely large structure heights and high aspect ratios are often required for micro- electrodeposition of mechanical components such as coils, cantilevers and valves. These ultra-thick photoresist can also be used as a mold in micro-electromechanical systems. Ultra-thick photoresist are also used in bump bond applications to define the size and location of the bonds for advanced flipchip packaging.

Citation Download Citation

Warren W. Flack, Sylvia White, and Bradley Todd "Process characterization of 100-μm-thick photoresist films", Proc. SPIE 3678, Advances in Resist Technology and Processing XVI, (11 June 1999); https://doi.org/10.1117/12.350230

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