Paper
30 August 1999 Pulsed-laser-deposited coatings for stiction and wear reduction in MEMS devices
Jamey S. Pelt, M. E. Ramsey, R. Magana Jr., E. Poindexter Jr., Maarten P. de Boer, David A. LaVan, Michael T. Dugger, James H. Smith, Steven M. Durbin
Author Affiliations +
Proceedings Volume 3874, Micromachining and Microfabrication Process Technology V; (1999) https://doi.org/10.1117/12.361206
Event: Symposium on Micromachining and Microfabrication, 1999, Santa Clara, CA, United States
Abstract
A wide variety of thin layer coatings have been reported for inhibiting the occurrence of post-release stiction in MEMS. Hydrophobic coatings such as self-assembled monolayers perform this function very well, but have a limited lifetime due to eventual generation of wear-induced damage. On the other hand, metallic oxides with superior wear resistance are hydrophilic in character, making them prone to stiction in humid environments. This paper describes the investigation of several dielectric materials as potential candidates for hydrophobic coatings with good wear resistant properties. Films were grown using a combination of vacuum deposition techniques, including enhanced variations of pulsed laser deposition. Contact angle and hardness measurements were performed on flat single crystal wafers for evaluation of film properties, and initial trials on a lateral friction test structure developed at Sandia National Laboratories were performed.
© (1999) COPYRIGHT Society of Photo-Optical Instrumentation Engineers (SPIE). Downloading of the abstract is permitted for personal use only.
Jamey S. Pelt, M. E. Ramsey, R. Magana Jr., E. Poindexter Jr., Maarten P. de Boer, David A. LaVan, Michael T. Dugger, James H. Smith, and Steven M. Durbin "Pulsed-laser-deposited coatings for stiction and wear reduction in MEMS devices", Proc. SPIE 3874, Micromachining and Microfabrication Process Technology V, (30 August 1999); https://doi.org/10.1117/12.361206
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Cited by 7 scholarly publications and 1 patent.
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KEYWORDS
Silicon carbide

Silicon films

Silicon

Carbon

Microelectromechanical systems

Nitrogen

Semiconducting wafers

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