Residual thermomechanical stresses in ultrathin chip stack technology

J. Puigcorbe; Sergio Leseduarte; Santiago Marco; Eric Beyne; Rita Van Hoof; Antoine Marty; Stephane Pinel; Olivier Vendier; Augustin Coello-Vera

doi:10.1117/12.382329

10 April 2000 Residual thermomechanical stresses in ultrathin chip stack technology

J. Puigcorbe, Sergio Leseduarte, Santiago Marco, Eric Beyne, Rita Van Hoof, Antoine Marty, Stephane Pinel, Olivier Vendier, Augustin Coello-Vera

Author Affiliations +

Proceedings Volume 4019, Design, Test, Integration, and Packaging of MEMS/MOEMS; (2000) https://doi.org/10.1117/12.382329
Event: Symposium on Design, Test, Integration, and Packaging of MEMS/MOEMS, 2000, Paris, France

Abstract

The aim of this work is to analyze the thermo-mechanical stresses evolution produced during the fabrication sequence of the multi-level UTCS structure. Several non-linear material models have been taken into account during the process of modeling. We have therefore resorted to the Finite Element Method for the evaluation of such thermo- mechanical stresses that appears in the manufacturing and stacking process. These efforts are made to optimize the product and process design.

Citation Download Citation

J. Puigcorbe, Sergio Leseduarte, Santiago Marco, Eric Beyne, Rita Van Hoof, Antoine Marty, Stephane Pinel, Olivier Vendier, and Augustin Coello-Vera "Residual thermomechanical stresses in ultrathin chip stack technology", Proc. SPIE 4019, Design, Test, Integration, and Packaging of MEMS/MOEMS, (10 April 2000); https://doi.org/10.1117/12.382329

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