Pellicle for F2 laser lithography

Toru Shirasaki; Meguru Kashida

doi:10.1117/12.392093

19 July 2000 Pellicle for F₂ laser lithography

Toru Shirasaki, Meguru Kashida

Proceedings Volume 4066, Photomask and Next-Generation Lithography Mask Technology VII; (2000) https://doi.org/10.1117/12.392093
Event: Photomask and Next Generation Lithography Mask Technology VII, 2000, Kanagawa, Japan

Abstract

The two possible 157nm-pellicle membrane materials are discussed. Currently polymers have considerable absorption at 157nm. The F₂ laser durability evaluation was carried out for the polymer with the least absorption. The polymer membrane suffered severe damage after short irradiation. What is the most important for the polymer membrane is to reduce the absorption at 157nm in order to increase the transmission and to improve the durability. Modified fused silica is the material for mask substrate for F₂ laser lithography. This fused silica shows good laser durability, but stringent tolerances are required when the fused silica plate is applied for pellicle membrane. Thickness uniformity and bending of plate are discussed.

Citation Download Citation

Toru Shirasaki and Meguru Kashida "Pellicle for F₂ laser lithography", Proc. SPIE 4066, Photomask and Next-Generation Lithography Mask Technology VII, (19 July 2000); https://doi.org/10.1117/12.392093

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