Real-time process control to prevent CD variation induced by postexposure delay

Chin-Yu Ku; Tan Fu Lei; Jia-Min Shieh; Tsann-Bim Chiou; Yung-Cheng Chen

doi:10.1117/12.410094

23 August 2000 Real-time process control to prevent CD variation induced by postexposure delay

Chin-Yu Ku, Tan Fu Lei, Jia-Min Shieh, Tsann-Bim Chiou, Yung-Cheng Chen

Proceedings Volume 4182, Process Control and Diagnostics; (2000) https://doi.org/10.1117/12.410094
Event: Microelectronic Manufacturing, 2000, Santa Clara, CA, United States

Abstract

One of the major problems for DUV resists is linewidth change owing to Post Exposure Delay (PED). Linewidth is mainly induced by acid diffusion during exposure and baking. Based on the mechanism of the neutralization of organic base and photo generated acid, a model had been generate din our previous study to describe the linewidth variation for different PED times. The derived equation can calculate the minimum elapse time, which will cause linewidth variation to exceed the specification of a specific CD. This work concludes that the smaller CD received a higher percentage of CD variation under PED for an isolated line pattern. Therefore, the minimum acceptable time for the smallest CD can be obtained based on +/- 10 percent of the nominal CD.

Citation Download Citation

Chin-Yu Ku, Tan Fu Lei, Jia-Min Shieh, Tsann-Bim Chiou, and Yung-Cheng Chen "Real-time process control to prevent CD variation induced by postexposure delay", Proc. SPIE 4182, Process Control and Diagnostics, (23 August 2000); https://doi.org/10.1117/12.410094

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