Failure analysis of advanced packaging technologies using scanning acoustic microscopy

John J. Barton; Anthony Compagno; Cian O'Mathuna

doi:10.1117/12.425281

23 April 2001 Failure analysis of advanced packaging technologies using scanning acoustic microscopy

John J. Barton, Anthony Compagno, Cian O'Mathuna

Proceedings Volume 4406, In-Line Characterization, Yield, Reliability, and Failure Analysis in Microelectronic Manufacturing II; (2001) https://doi.org/10.1117/12.425281
Event: Microelectronic and MEMS Technologies, 2001, Edinburgh, United Kingdom

Abstract

In recent years, scanning acoustic microscopy (SAM) has been found to be a very successful technique when used in the microelectronics industry to evaluate, from a reliability perspective, standard plastic packaging technologies such as PQFP's, PLCC's, DIP's and SOP's. The recent explosion of advanced packaging techniques such as Chip-on-Board, Flip-chip and BGA and the proliferation of Microsystems has further widened the arena of what constitutes microelectronics. With such a wide breadth of devices from standard plastic packages to state-of-the-art microsystems, it is difficult to find a failure analysis technique which can cope competently with that scope. SAM is one such technique. This paper will demonstrate the effectiveness of SAM at non-destructively analyzing a range of advanced packaging technologies from integrated passive to flip-chip to microsystems.

Citation Download Citation

John J. Barton, Anthony Compagno, and Cian O'Mathuna "Failure analysis of advanced packaging technologies using scanning acoustic microscopy", Proc. SPIE 4406, In-Line Characterization, Yield, Reliability, and Failure Analysis in Microelectronic Manufacturing II, (23 April 2001); https://doi.org/10.1117/12.425281

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