Paper
23 April 2001 In-line inspection method with AIT-II and ADC
Kathleen Terryll, Carlos Mateos
Author Affiliations +
Abstract
In this article, we emphasize the streamlined, in-line inspection methodology at Agere Systems, Madrid, Spain (formally Lucent Technologies, Microelectronics). This method includes the use of AIT-II with Impact ADC 2.0 to better focus and separate out excursion and baseline events. Real life examples demonstrating the potential of ADC are presented. In continuation, the shop reaction methodology and data flow scheme is described in detail. Currently, the Agere systems methodology is one of the most advanced in the European semiconductor industry.
© (2001) COPYRIGHT Society of Photo-Optical Instrumentation Engineers (SPIE). Downloading of the abstract is permitted for personal use only.
Kathleen Terryll and Carlos Mateos "In-line inspection method with AIT-II and ADC", Proc. SPIE 4406, In-Line Characterization, Yield, Reliability, and Failure Analysis in Microelectronic Manufacturing II, (23 April 2001); https://doi.org/10.1117/12.425284
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KEYWORDS
Inspection

Semiconducting wafers

Scanning electron microscopy

Defect detection

Microelectronics

Oxides

Photoresist materials

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