Experimental investigation on the complex thermomechanical behavior of plastic packages

Sung Yi; Fei Su; Fulong Dai; Lie Liu; Vora Mehul

doi:10.1117/12.468761

29 May 2002 Experimental investigation on the complex thermomechanical behavior of plastic packages

Sung Yi, Fei Su, Fulong Dai, Lie Liu, Vora Mehul

Proceedings Volume 4537, Third International Conference on Experimental Mechanics; (2002) https://doi.org/10.1117/12.468761
Event: Third International Conference on Experimental Mechanics, 2002, Beijing, China

Abstract

In this paper, an integrated 3D moire system is introduced and the complex thermo-mechanical behavior of plastic packages is revealed with this system. Testing results show the thermo- mechanical behavior of plastic packages is time dependent, thermal experience dependant and moisture sensitive. The introduced 3D Moire system and testing result provide a basis for further investigation on this problem, e.g. it can provide boundary condition or result confirmation for the FEM investigation.

Citation Download Citation

Sung Yi, Fei Su, Fulong Dai, Lie Liu, and Vora Mehul "Experimental investigation on the complex thermomechanical behavior of plastic packages", Proc. SPIE 4537, Third International Conference on Experimental Mechanics, (29 May 2002); https://doi.org/10.1117/12.468761

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