Assembly process issues and reliability in microsystem packaging

Leland Spangler

doi:10.1117/12.531901

23 December 2003 Assembly process issues and reliability in microsystem packaging

Leland Spangler

Proceedings Volume 5343, Reliability, Testing, and Characterization of MEMS/MOEMS III; (2003) https://doi.org/10.1117/12.531901
Event: Micromachining and Microfabrication, 2004, San Jose, California, United States

Abstract

Microsystem packages and package assembly processes have an enormous influence on the ability to successfully bring a microsystem product to market. Package and assembly processes can introduce both performance and reliability issues which can introduce significant delays in the product engineering cycle. Typically, thousands of devices must be made and tested to fully quantify the reliability of a microsystem product. While most microsystem products use package and package assembly technology adapted from the integrated circuit industry, the unique aspects of these devices requires unique package designs and unique implementation of the unit assembly processes. This paper discusses many of these unit processes, their adaptation to microsystem applications and the reliability issues that can be traced back to these processes. Solutions to these package assembly issues will also be presented.

Citation Download Citation

Leland Spangler "Assembly process issues and reliability in microsystem packaging", Proc. SPIE 5343, Reliability, Testing, and Characterization of MEMS/MOEMS III, (23 December 2003); https://doi.org/10.1117/12.531901

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KEYWORDS

Microsystems

Reliability

Semiconducting wafers

Gold

Adhesives

Metals

Packaging

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