Bond enhance of hydroxyapatite/silicon layers by introducing a porous silicon interlayer

Shaoqiang Chen; Jianzhong Zhu; Jian Zhang; Xiao Feng; Yanling Shi; Xiaohua Wang; Laiqiang Luo; Ziqiang Zhu

doi:10.1117/12.607803

8 December 2004 Bond enhance of hydroxyapatite/silicon layers by introducing a porous silicon interlayer

Shaoqiang Chen, Jianzhong Zhu, Jian Zhang, Xiao Feng, Yanling Shi, Xiaohua Wang, Laiqiang Luo, Ziqiang Zhu

Proceedings Volume 5774, Fifth International Conference on Thin Film Physics and Applications; (2004) https://doi.org/10.1117/12.607803
Event: Fifth International Conference on Thin Film Physics and Applications, 2004, Shanghai, China

Abstract

Hydroxyapatite (HAP) nano-particles obtained by coprecipitate process are deposited on porous silicon substrates, after being annealed, HAP films connected tightly with porous silicon substrates. The resulted samples were investigated by XRD, AFM and SEM.

Citation Download Citation

Shaoqiang Chen, Jianzhong Zhu, Jian Zhang, Xiao Feng, Yanling Shi, Xiaohua Wang, Laiqiang Luo, and Ziqiang Zhu "Bond enhance of hydroxyapatite/silicon layers by introducing a porous silicon interlayer", Proc. SPIE 5774, Fifth International Conference on Thin Film Physics and Applications, (8 December 2004); https://doi.org/10.1117/12.607803

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