Fast and accurate 3D mask model for full-chip OPC and verification

Peng Liu; Yu Cao; Luoqi Chen; Guangqing Chen; Mu Feng; Jiong Jiang; Hua-yu Liu; Sungsoo Suh; Sung-Woo Lee; Sukjoo Lee

doi:10.1117/12.712171

26 March 2007 Fast and accurate 3D mask model for full-chip OPC and verification

Peng Liu, Yu Cao, Luoqi Chen, Guangqing Chen, Mu Feng, Jiong Jiang, Hua-yu Liu, Sungsoo Suh, Sung-Woo Lee, Sukjoo Lee

Proceedings Volume 6520, Optical Microlithography XX; 65200R (2007) https://doi.org/10.1117/12.712171
Event: SPIE Advanced Lithography, 2007, San Jose, California, United States

Abstract

A new framework has been developed to model 3D thick mask effects for full-chip OPC and verifications. In addition to electromagnetic (EM) scattering effects, the new model also takes into account the non-Hopkins oblique incidence effects commonly found in real lithography systems but missing in prior arts. Evaluations against rigorous simulations and experimental data showed the new model provides improved accuracy, compared to both the thin-mask model and the thick-mask model based on Hopkins treatment of oblique incidence.

Citation Download Citation

Peng Liu, Yu Cao, Luoqi Chen, Guangqing Chen, Mu Feng, Jiong Jiang, Hua-yu Liu, Sungsoo Suh, Sung-Woo Lee, and Sukjoo Lee "Fast and accurate 3D mask model for full-chip OPC and verification", Proc. SPIE 6520, Optical Microlithography XX, 65200R (26 March 2007); https://doi.org/10.1117/12.712171

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