Micro-mold fabrication using cellulose acetate

K. Y. Cho; H. K. Lim; Y. Chen; Jaehwan Kim; K. S. Kang

doi:10.1117/12.715881

11 April 2007 Micro-mold fabrication using cellulose acetate

K. Y. Cho, H. K. Lim, Y. Chen, Jaehwan Kim, K. S. Kang

Author Affiliations +

Proceedings Volume 6528, Nanosensors, Microsensors, and Biosensors and Systems 2007; 65280C (2007) https://doi.org/10.1117/12.715881
Event: SPIE Smart Structures and Materials + Nondestructive Evaluation and Health Monitoring, 2007, San Diego, California, United States

Abstract

Polymer materials offer numerous advantages including flexible, low cost large area displays, lightweight, easy processing, good compatibility with a variety of substrates, and easy for structural modifications. Recently electro-active polymers (EAP) have been attractive due to their potential advantages including ease of processing and control, mechanical flexibility, and economical advantage. Recently electro-active paper (EAPap) was discovered as a smart material and as an actuating material with ionic and piezoelectric effects. Before cellulose acetate (CA) micro-pattern fabrication, solvent effect of micro or nano-pore formation was investigated. Since the micropore scatter the visible light, micropores give negative effect to apply optical device. The solvent mixture of acetone/dimethylacetamide (DMAc) created large amount of micro or nanopores. The resulting films were not transparent. However, volatile single solvent (acetone) did not form pores and gave transparent film. The various shapes of photoresist, such as circle and honeycomb patterns, were fabricated onto the silicon wafer to use as the mold. Cellulose acetate (CA) was poured to the mold and peeled off from the mold. The resulting pattern exhibited uniform size of the circle or honeycomb shape without defect.

Citation Download Citation

K. Y. Cho, H. K. Lim, Y. Chen, Jaehwan Kim, and K. S. Kang "Micro-mold fabrication using cellulose acetate", Proc. SPIE 6528, Nanosensors, Microsensors, and Biosensors and Systems 2007, 65280C (11 April 2007); https://doi.org/10.1117/12.715881

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