A high-speed 850-nm optical receiver by integrating Si photodiode and CMOS IC

Y. M. Hsin; W. K. Huang; Y. C. Liu; B. E. Yan; W. Z. Chen

doi:10.1117/12.761553

8 February 2008 A high-speed 850-nm optical receiver by integrating Si photodiode and CMOS IC

Y. M. Hsin, W. K. Huang, Y. C. Liu, B. E. Yan, W. Z. Chen

Proceedings Volume 6899, Photonics Packaging, Integration, and Interconnects VIII; 68990P (2008) https://doi.org/10.1117/12.761553
Event: Integrated Optoelectronic Devices 2008, 2008, San Jose, California, United States

Abstract

In this work, three approaches are proposed to implement high-speed 850-nm optical receivers fully in standard bulk 0.18 μm silicon (Si) CMOS technology. In the first approach, the lateral p-i-n photodiode (PD) with designed block well to limit the photocarriers being generated from the laterally depleted regions is integrated in optical receiver. The receiver consists of TIA, LA, offset-cancellation-network and buffer to provide a conversion gain of 110 dBΩ and data rate of 2.5 Gbps operation. In the second receiver, the spatially modulated PD (SMPD) with -3 dB bandwidth of 590 MHz is integrated in optical receiver with the extra adaptive equalizer and demonstrates a data rate of 3.125 Gbps. Finally, the proposed novel structure of PD eliminates the slow diffusion photocarriers by using body contact design to create a new current path under the PD. A bandwidth of 2.8 GHz with 100 % improvement in PD is obtained. The eye diagrams of PD with cable connected amplifiers at 2.5 Gbps, 4 Gbps and 5 Gbps are demonstrated. Furthermore, the optical receiver's optical-electrical (O-E) conversion bandwidth is also increased from 3.6 GHz to 4.3 GHz. To our knowledge, these are the highest O-E conversion bandwidth of the PD and optical receiver ever reported by using the standard bulk 0.18 μm Si CMOS technology.

Citation Download Citation

Y. M. Hsin, W. K. Huang, Y. C. Liu, B. E. Yan, and W. Z. Chen "A high-speed 850-nm optical receiver by integrating Si photodiode and CMOS IC", Proc. SPIE 6899, Photonics Packaging, Integration, and Interconnects VIII, 68990P (8 February 2008); https://doi.org/10.1117/12.761553

ACCESS THE FULL ARTICLE

INSTITUTIONAL
Select your institution to access the SPIE Digital Library.

SELECT YOUR INSTITUTION

PERSONAL
Sign in with your SPIE account to access your personal subscriptions or to use specific features such as save to my library, sign up for alerts, save searches, etc.

PERSONAL SIGN IN

No SPIE Account? Create one

PURCHASE THIS CONTENT

SUBSCRIBE TO DIGITAL LIBRARY

50 downloads per 1-year subscription

Members: $195

Non-members: $335 ADD TO CART

25 downloads per 1 - year subscription

Members: $145

Non-members: $250 ADD TO CART

PURCHASE SINGLE ARTICLE

Includes PDF, HTML & Video, when available