Development and implementation of PWQ on patterned wafer darkfield inspection systems

Uwe Streller; Kay Wendt; Arno Wehner; Jens Goeckeritz; Markus Gahr; Martin Tuckermann; Jennifer Kopp; Monica Hellerqvist

doi:10.1117/12.814149

23 March 2009 Development and implementation of PWQ on patterned wafer darkfield inspection systems

Uwe Streller, Kay Wendt, Arno Wehner, Jens Goeckeritz, Markus Gahr, Martin Tuckermann, Jennifer Kopp, Monica Hellerqvist

Author Affiliations +

Proceedings Volume 7272, Metrology, Inspection, and Process Control for Microlithography XXIII; 72723J (2009) https://doi.org/10.1117/12.814149
Event: SPIE Advanced Lithography, 2009, San Jose, California, United States

Abstract

Process Window Qualification (PWQ) is a well-established wafer inspection technique used to qualify the design of mask sets and to characterize lithography process windows. While PWQ typically employs a broadband brightfield inspector, novel techniques for patterned wafer darkfield inspection have proven to provide sufficient sensitivity along with noise suppression benefits for lithography layers. This paper describes the introduction and implementation of PWQ on patterned wafer darkfield inspectors. An initial project characterized critical PWQ requirements on the darkfield inspector. The results showed that this new approach meets performance requirements, such as defect of interest (DOI) detection and process window characterization, as well as ease-of-use requirements such as automated setup for advanced design rule products.

Citation Download Citation

Uwe Streller, Kay Wendt, Arno Wehner, Jens Goeckeritz, Markus Gahr, Martin Tuckermann, Jennifer Kopp, and Monica Hellerqvist "Development and implementation of PWQ on patterned wafer darkfield inspection systems", Proc. SPIE 7272, Metrology, Inspection, and Process Control for Microlithography XXIII, 72723J (23 March 2009); https://doi.org/10.1117/12.814149

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