The mechanism for material removal in ductile mode cutting of CaF2 brittle crystals

Haofeng Chen; Yifan Dai; Xiaoqiang Peng; Ziwen Zheng; Chaoliang Guan

doi:10.1117/12.866633

6 October 2010 The mechanism for material removal in ductile mode cutting of CaF₂ brittle crystals

Haofeng Chen, Yifan Dai, Xiaoqiang Peng, Ziwen Zheng, Chaoliang Guan

Proceedings Volume 7655, 5th International Symposium on Advanced Optical Manufacturing and Testing Technologies: Advanced Optical Manufacturing Technologies; 76550G (2010) https://doi.org/10.1117/12.866633
Event: 5th International Symposium on Advanced Optical Manufacturing and Testing Technologies, 2010, Dalian, China

Abstract

Single-crystal calcium fluoride (CaF₂) is an indispensable optical material for the deep ultraviolet radiation lithography system. The requirement for extremely high performance using in lithography system can be not satisfied by using conventional polishing because the polishing powder are easy to embed to surface due to its relative softness. In the process of rough finishing of CaF₂, ductile cutting of CaF₂ is considered as a suitable technology instead of tradition polishing to efficiently achieve super-smooth surface without impurity. In this paper, a theoretical and experimental study on the ductile cutting of CaF₂ is presented. An energy model for ductile mode cutting of CaF₂ is developed, in which the critical undeformed chip thickness can be predicted from the workpiece material characteristics and cutting parameters. The model is verified with experimental results from the micro-grooving of CaF₂ on an ultra-precision lathe using a circle diamond crystals tool. The pattern of micro-grooving is inspected using optical microscope, the critical cutting depth of ductile-to-brittle is measured using white-light interferometer. It is shown that the predicted results for the critical undeformed chip thickness corresponding to ductile cutting agree well with the experimental results. Finally, ductile cutting of CaF₂ is carried out under the cutting conditions as the maximum undeformed thickness less than the critical undeformed thickness of 233nm obtained above, ductile mode cutting of CaF₂ has been achieved a super smooth surface with roughness of 3.50nm (Ra) measured by AFM is obtained.

Citation Download Citation

Haofeng Chen, Yifan Dai, Xiaoqiang Peng, Ziwen Zheng, and Chaoliang Guan "The mechanism for material removal in ductile mode cutting of CaF₂ brittle crystals", Proc. SPIE 7655, 5th International Symposium on Advanced Optical Manufacturing and Testing Technologies: Advanced Optical Manufacturing Technologies, 76550G (6 October 2010); https://doi.org/10.1117/12.866633

ACCESS THE FULL ARTICLE

INSTITUTIONAL
Select your institution to access the SPIE Digital Library.

SELECT YOUR INSTITUTION

PERSONAL
Sign in with your SPIE account to access your personal subscriptions or to use specific features such as save to my library, sign up for alerts, save searches, etc.

PERSONAL SIGN IN

No SPIE Account? Create one

PURCHASE THIS CONTENT

SUBSCRIBE TO DIGITAL LIBRARY

50 downloads per 1-year subscription

Members: $195

Non-members: $335 ADD TO CART

25 downloads per 1 - year subscription

Members: $145

Non-members: $250 ADD TO CART

PURCHASE SINGLE ARTICLE

Includes PDF, HTML & Video, when available

Members: $17.00

Non-members: $21.00 ADD TO CART

PROCEEDINGS
5 PAGES

DOWNLOAD PAPER SAVE TO MY LIBRARY

GET CITATION

RIGHTS & PERMISSIONS

Get copyright permission Get copyright permission on Copyright Marketplace

KEYWORDS

Crystals

Polishing

Surface finishing

Interferometers

Photomicroscopy

Atomic force microscopy

Lithography

Show All Keywords

Keywords/Phrases

Search In:

Publication Years