High-Speed Reticle Qualification System

Hirobumi Ishihara; Tokuro Sooma; Morio Misonoo; Kei Takatsu; Kiyohiko Akanuma

doi:10.1117/12.967057

1 January 1987 High-Speed Reticle Qualification System

Hirobumi Ishihara, Tokuro Sooma, Morio Misonoo, Kei Takatsu, Kiyohiko Akanuma

Proceedings Volume 0772, Optical Microlithography VI; (1987) https://doi.org/10.1117/12.967057
Event: Microlithography Conferences, 1987, Santa Clara, CA, United States

Abstract

Wafer steppers play an important role in VLSI production. However, wafer exposure by a stepper requires both a perfect or defect-free reticle and an elaborate resist process. When a reticle is produced by mask shop its perfection or pattern integrity is guarantteed with a reticle inspection system. When introduced and used in the VLSI production, however, the reticle sometimes becomes defective due to falling particles and/or chrominum peel-off caused by inadequate reticle cleaning. Even with a pellicle, the reticle gets contaminated with dusts caused by careless handling. Therefore, the in-situ reticle inspection or reticle qualification is necessary to secure the exposure of product wafers.

Citation Download Citation

Hirobumi Ishihara, Tokuro Sooma, Morio Misonoo, Kei Takatsu, and Kiyohiko Akanuma "High-Speed Reticle Qualification System", Proc. SPIE 0772, Optical Microlithography VI, (1 January 1987); https://doi.org/10.1117/12.967057

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