Paper
15 November 2011 Surface warpage measurement of diamond grid disk by shadow Moiré method
Terry Yuan-Fang Chen, Jian-Shiang Chen
Author Affiliations +
Proceedings Volume 8321, Seventh International Symposium on Precision Engineering Measurements and Instrumentation; 83213R (2011) https://doi.org/10.1117/12.905441
Event: Seventh International Symposium on Precision Engineering Measurements and Instrumentation, 2011, Yunnan, China
Abstract
Diamond grid disk dresser is frequently employed to remove the accumulated debris lest the polishing surface glazes. The surface warpage of diamond grid disk must be small enough to assure the flatness of polished wafers during chemical mechanical planarization process. In this study, phase-shifted shadow moiré method was employed to measure the surface warpage of diamond grid disks. To eliminate erroneous bright or black spots caused by the diamond grids, a novel method is proposed by selecting proper threshold values from the addition of four phase-shifted images, and from the grey-level difference between the addition of phases 0 and π images and the addition of phases π/2 and 3π/2 images. Test of the proposed method on real specimens show that the erroneous bright and black spots can be effectively identified and patched. Thereafter the phase can be unwrapped successfully to obtain the surface profile and thus the warpage of specimens.
© (2011) COPYRIGHT Society of Photo-Optical Instrumentation Engineers (SPIE). Downloading of the abstract is permitted for personal use only.
Terry Yuan-Fang Chen and Jian-Shiang Chen "Surface warpage measurement of diamond grid disk by shadow Moiré method", Proc. SPIE 8321, Seventh International Symposium on Precision Engineering Measurements and Instrumentation, 83213R (15 November 2011); https://doi.org/10.1117/12.905441
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KEYWORDS
Diamond

Fringe analysis

Surface finishing

Polishing

Chemical mechanical planarization

Phase shifts

Moire patterns

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