Multiple Fiber Interconnect Using Silicon V-Grooves

P. C. Chang; S. Sriram; A. C. Wey

doi:10.1117/12.967544

1 January 1987 Multiple Fiber Interconnect Using Silicon V-Grooves

P. C. Chang, S. Sriram, A. C. Wey

Proceedings Volume 0836, Optoelectronic Materials, Devices, Packaging, and Interconnects; (1987) https://doi.org/10.1117/12.967544
Event: Cambridge Symposium on Fiber Optics and Integrated Optoelectronics, 1987, Cambridge, MA, United States

Abstract

A new interconnect method for multiple fibers is reported. The design concept proposes novel silicon components to align and position multifiber subassemblies, which have V-grooves to capture either fiber ribbon or monocoated fibers. The silicon components are fabricated by using preferential crystallographic etching techniques. This approach differs from earlier efforts, as preferential etching of silicon is used not only for the fiber placement, but for array alignment as well. Preliminary results are presented to demonstrate the concept.

Citation Download Citation

P. C. Chang, S. Sriram, and A. C. Wey "Multiple Fiber Interconnect Using Silicon V-Grooves", Proc. SPIE 0836, Optoelectronic Materials, Devices, Packaging, and Interconnects, (1 January 1987); https://doi.org/10.1117/12.967544

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