20nm VIA BEOL patterning challenges

Chien-Hsien S. Lee; Sohan Singh Mehta; Wontae Hwang; Hui Husan Tsai; Michael Anderson; Yayi Wei; Matthew Herrick; Xiang Hu; Bumhwan Jeon; Shyam Pal

doi:10.1117/12.2011843

29 March 2013 20nm VIA BEOL patterning challenges

Chien-Hsien S. Lee, Sohan Singh Mehta, Wontae Hwang, Hui Husan Tsai, Michael Anderson, Yayi Wei, Matthew Herrick, Xiang Hu, Bumhwan Jeon, Shyam Pal

Author Affiliations +

Proceedings Volume 8682, Advances in Resist Materials and Processing Technology XXX; 86820D (2013) https://doi.org/10.1117/12.2011843
Event: SPIE Advanced Lithography, 2013, San Jose, California, United States

Abstract

Higher density on 20nm logic chips require tighter pitches to be implemented not only at critical metal layers, but at BEOL critical VIA layers as well. Smaller pitches on critical via are no longer achievable through the conventional positive tone development (PTD) process. Instead, negative tone development (NTD) is considered, evaluated, and integrated as an alternative, along with the double patterning (DP) method. Additionally, preliminary results on NTD+DP patterning challenges, including patterning verification, are presented in this paper.

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Chien-Hsien S. Lee, Sohan Singh Mehta, Wontae Hwang, Hui Husan Tsai, Michael Anderson, Yayi Wei, Matthew Herrick, Xiang Hu, Bumhwan Jeon, and Shyam Pal "20nm VIA BEOL patterning challenges", Proc. SPIE 8682, Advances in Resist Materials and Processing Technology XXX, 86820D (29 March 2013); https://doi.org/10.1117/12.2011843

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