Paper
17 May 2013 MEMS pressure sensor with maximum performances by using novel back-side direct-exposure concept featuring through glass vias
B. Mukhopadhyay, M. Fritz, P. Mackowiak, T. C. Vu, O. Ehrmann, K.-D. Lang, H.-D. Ngo
Author Affiliations +
Proceedings Volume 8763, Smart Sensors, Actuators, and MEMS VI; 87632N (2013) https://doi.org/10.1117/12.2017159
Event: SPIE Microtechnologies, 2013, Grenoble, France
Abstract
Design, simulation, fabrication, and characterization of novel MEMS pressure sensors with new back-side-direct-exposure packaging concept are presented. The sensor design is optimized for harsh environments e.g. space, military, offshore and medical applications. Unbreakable connection between the active side of the Si-sensor and the protecting glass capping was realized by anodic bonding using a thin layer of metal. To avoid signal corruption of the measured pressure caused by an encapsulation system, the media has direct contact to the backside of the Si membrane and can deflect it.
© (2013) COPYRIGHT Society of Photo-Optical Instrumentation Engineers (SPIE). Downloading of the abstract is permitted for personal use only.
B. Mukhopadhyay, M. Fritz, P. Mackowiak, T. C. Vu, O. Ehrmann, K.-D. Lang, and H.-D. Ngo "MEMS pressure sensor with maximum performances by using novel back-side direct-exposure concept featuring through glass vias", Proc. SPIE 8763, Smart Sensors, Actuators, and MEMS VI, 87632N (17 May 2013); https://doi.org/10.1117/12.2017159
Advertisement
Advertisement
RIGHTS & PERMISSIONS
Get copyright permission  Get copyright permission on Copyright Marketplace
KEYWORDS
Sensors

Silicon

Glasses

Microelectromechanical systems

Semiconducting wafers

Environmental sensing

Packaging

RELATED CONTENT


Back to Top