Color image sensor using stacked organic photoconductive films with transparent readout circuits separated by thin interlayer insulator

Toshikatsu Sakai; Hokuto Seo; Satoshi Aihara; Hiroshi Ohtake; Misao Kubota; Mamoru Furuta

doi:10.1117/12.2037144

4 March 2014 Color image sensor using stacked organic photoconductive films with transparent readout circuits separated by thin interlayer insulator

Toshikatsu Sakai, Hokuto Seo, Satoshi Aihara, Hiroshi Ohtake, Misao Kubota, Mamoru Furuta

Author Affiliations +

Proceedings Volume 9022, Image Sensors and Imaging Systems 2014; 90220J (2014) https://doi.org/10.1117/12.2037144
Event: IS&T/SPIE Electronic Imaging, 2014, San Francisco, California, United States

Abstract

We have been working on developing an image sensor with three stacked organic photoconductive films (OPFs) sensitive to only one primary color component (red—R, green—G, or blue—B); each OPF has a signal readout circuit. This type of stacked sensor is advantageous for the manufacture of compact color cameras with high-quality pictures, since color separation systems, such as prisms or color filter arrays, are eliminated because of the color selectivity of OPFs. To achieve a high-resolution stacked sensor, its total thickness should be reduced to less than 10 μm. In this study, we fabricated a color image sensor with R and G-sensitive OPFs by applying amorphous In-Ga-Zn-O thin-film transistor (TFT) readout circuits. A 10 μm-thick interlayer insulator separated the R and G-sensitive layers. The entire fabrication process for the device was implemented below 150°C to avoid damaging the OPFs. Output signals were successfully read from each OPF through the TFT circuit, and multi-color images were reproduced from the fabricated sensor.

Citation Download Citation

Toshikatsu Sakai, Hokuto Seo, Satoshi Aihara, Hiroshi Ohtake, Misao Kubota, and Mamoru Furuta "Color image sensor using stacked organic photoconductive films with transparent readout circuits separated by thin interlayer insulator", Proc. SPIE 9022, Image Sensors and Imaging Systems 2014, 90220J (4 March 2014); https://doi.org/10.1117/12.2037144

ACCESS THE FULL ARTICLE

INSTITUTIONAL
Select your institution to access the SPIE Digital Library.

SELECT YOUR INSTITUTION

PERSONAL
Sign in with your SPIE account to access your personal subscriptions or to use specific features such as save to my library, sign up for alerts, save searches, etc.

PERSONAL SIGN IN

No SPIE Account? Create one

;

PURCHASE THIS CONTENT

SUBSCRIBE TO DIGITAL LIBRARY

50 downloads per 1-year subscription

Members: $195

Non-members: $335 ADD TO CART

25 downloads per 1 - year subscription

Members: $145

Non-members: $250 ADD TO CART

PURCHASE SINGLE ARTICLE