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The CID Number appears on each page of the manuscript. The complete citation is used on the first page, and an abbreviated version on subsequent pages. Numbers in the index correspond to the last two digits of the six-digit CID Number. Conference CommitteesSymposium Chair Symposium Vice-chair Advisory Committee Chair Advisory Committee Morihisa Hoga, Dai Nippon Printing Company, Ltd. (Japan) Masao Otaki Tadahiro Takigawa Yoshio Tanaka, Luminescent Technologies, Inc. (Japan)
Organizing Committee Chair Organizing Committee Vice-chair Organizing Committee Uwe Behringer, UBC Microelectronics (Germany) Parkson Chen, Taiwan Mask Corporation (Taiwan) Han-ku Cho, Samsung Electronics Company, Ltd. (Korea, Republic of) Junko Collins, SEMI Japan (Japan) Brian J. Grenon, Advanced Technical Instruments (United States) Takehiko Gunji, Sony Corporation (Japan) Hideaki Hamada, HTL Company Japan Ltd. (Japan) Naoya Hayashi, Dai Nippon Printing Company, Ltd. (Japan) Eiichi Hoshino, Nikon Corporation (Japan) Kunihiro Hosono, Renesas Electronics Corporation (Japan) Kokoro Kato, Hitachi High-Tech Science Corporation (Japan) Hideaki Mitsui, HOYA Corporation (Japan) Warren Montgomery, CNSE (United States) Ichiro Mori, EUVL Infrastructure Development Center, Inc. (Japan) Hiroaki Morimoto, Toppan Printing Company, Ltd. (Japan) Yoshiki Suzuki, KLA-Tencor Japan Ltd. (Japan) Yoji Tonooka, Toppan Printing Company, Ltd. (Japan) Koichiro Tsujita, Canon Inc. (Japan) Anto Yasaka, Hitachi High-Tech Science Corporation (Japan)
Steering Committee Chair Steering Committee Vice-chairs Kunihiro Hosono, Renesas Electronics Corporation (Japan) Hidehiro Watanabe, EUVL Infrastructure Development Center, Inc. (Japan)
Steering Committee Takayuki Abe, NuFlare Technology Inc. (Japan) Akihiko Ando, Renesas Electronics Corporation (Japan) Kazuko Jochi, KLA-Tencor Japan Ltd. (Japan) Takashi Kamo, Toshiba Corporation Corporate Research and Development Center (Japan) Kokoro Kato, Hitachi High-Tech Science Corporation (Japan) Yasutaka Morikawa, Dai Nippon Printing Company, Ltd. (Japan) Teruaki Noguchi, JEOL Ltd. (Japan) Yasushi Ohkubo, HOYA Corporation (Japan) Tomoyuki Okada, Fujitsu Semiconductor Ltd. (Japan) Kiwamu Takehisa, Lasertec Corporation (Japan) Hiroyoshi Tanabe, Intel K.K. (Japan) Nobuyuki Yoshioka, Dai Nippon Printing Company, Ltd. (Japan)
Program Committee Chair Program Committee Vice-chairs Akihiko Ando, Renesas Electronics Corporation (Japan) Nobuyuki Yoshioka, Dai Nippon Printing Company, Ltd. (Japan)
Program Committee Tsukasa Abe, Dai Nippon Printing Company, Ltd. (Japan) Jeff Farnsworth, Intel Corporation Technology and Manufacturing Group (United States) Thomas B. Faure, IBM Corporation (United States) Kazuyuki Hagiwara, D2S, K.K. (Japan) Shigeru Hirukawa, Nikon Corporation (Japan) Koji Hosono, Fujitsu Semiconductor Ltd. (Japan) Hidemichi Imai, Dai Nippon Printing Company, Ltd. (Japan) Ichiro Kagami, Sony Semiconductor Corporation (Japan) Franklin Kalk, Toppan Photomasks, Inc. (United States) Byung-Gook Kim, Samsung Electronics Company, Ltd. (Korea, Republic of) Yutaka Kodera, Toppan Printing Company, Ltd. (Japan) Jun Kotani, Toppan Printing Company, Ltd. (Japan) John Lin, Taiwan Semiconductor Manufacturing Company (Taiwan) Mark Ma, Photronics, Inc. (United States) Junji Miyazaki, ASML Japan Company, Ltd. (Japan) Koji Murano, TOSHIBA Corporation (Japan) Yoshinori Nagaoka, KLA-Tencor Japan Ltd. (Japan) Yasutoshi Nakagawa, JEOL Ltd. (Japan) Noriaki Nakayamada, NuFlare Technology Inc. (Japan) Naoki Nishida, HOYA Corporation (Japan) Yuji Nonami, Panasonic Corporation (Japan) Steffen Schulze, Mentor Graphics Corporation (United States) Yasunari Sohda, Hitachi, Ltd. (Japan) Osamu Suga, EUVL Infrastructure Development Center, Inc. (Japan) Yasuko Tabata, TowerJazz Panasonic Semiconductor, Ltd. (Japan) Yoji Takagi, Applied Materials Japan, Inc. (Japan) Kiwamu Takehisa, Lasertec Corporation (Japan) Richard Tseng, Taiwan Mask Corporation (Taiwan) Yoichi Usui, HOYA Corporation (Japan) Nobuhiko Yabu, Canon Inc. (Japan) Tetsuya Yamamoto, KLA-Tencor Corporation (United States)
Session Chairs 1 Opening Session Kokoro Kato, Hitachi High-Tech Science Corporation (Japan) 2 Inspection and Cleaning Akihiko Ando, Renesas Electronics Corporation (Japan) Hidemichi Imai, Dai Nippon Printing Company, Ltd. (Japan) 3 NIL Jun Kotani, Toppan Printing Company, Ltd. (Japan) 4 Writing Technologies Uwe Behringer, UBC Microelectronics (Germany) Noriaki Nakayamada, NuFlare Technology, Inc. (Japan) 5 Lithography Related Technologies Nobuyuki Yoshioka, Dai Nippon Printing Company, Ltd. (Japan) 6 FPD Masks Ichiro Kagami, Sony Semiconductor Corporation (Japan) Nobuhiko Yabu, Canon Inc. (Japan) 8 Invited Session Thomas Faure, IBM Corporation (United States) Yoshinori Nagaoka, KLA-Tencor Japan Ltd. (Japan) 9 Metrology Thomas Faure, IBM Corporation (USA) Yoshinori Nagaoka, KLA-Tencor Japan Ltd. (Japan) 10 EUVL Masks I Natalia Davydova, ASML Netherlands B. V. (The Netherlands) Tsukasa Abe, Dai Nippon Printing Company, Ltd. (Japan) 11 EUVL Masks II Jeff Farnsworth, Intel Corporation (United States) Koji Murano, Toshiba Corporation (Japan) 12 EUVL Masks III Byung-Gook Kim, Samsung Electronics (Korea, Republic of) Yutaka Kodera, Toppan Printing Company, Ltd. (Japan)
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