Paper
6 August 2014 A high efficiency machining method of SiC: ion-enhanced atmospheric pressure plasma machining
Baolu Shi, Xuhui Xie, Yifan Dai, Chunde Liao
Author Affiliations +
Proceedings Volume 9281, 7th International Symposium on Advanced Optical Manufacturing and Testing Technologies: Advanced Optical Manufacturing Technologies; 928104 (2014) https://doi.org/10.1117/12.2069012
Event: 7th International Symposium on Advanced Optical Manufacturing and Testing Technologies (AOMATT 2014), 2014, Harbin, China
Abstract
An ion-enhanced atmospheric pressure plasma machining (IAPPM) method is introduced to improve the processing efficiency of SiC. The argon inductively coupled plasma is generated in designed the IAPPM machine. SF6 chosen as the reactive gas is injected into the argon plasma where SF6 is broken down into fluorine radicals. The reactive atoms are delivered onto the surface of SiC, and SiF4 is generated which is exhausted in the gaseous form. The material removal rate is increased by bringing in the energetic ions bombardment. Three linear trenches were etched onto the S-SiC sample. The etch rate is 3μm/min. The surface becomes rough after the IAPPM process.
© (2014) COPYRIGHT Society of Photo-Optical Instrumentation Engineers (SPIE). Downloading of the abstract is permitted for personal use only.
Baolu Shi, Xuhui Xie, Yifan Dai, and Chunde Liao "A high efficiency machining method of SiC: ion-enhanced atmospheric pressure plasma machining", Proc. SPIE 9281, 7th International Symposium on Advanced Optical Manufacturing and Testing Technologies: Advanced Optical Manufacturing Technologies, 928104 (6 August 2014); https://doi.org/10.1117/12.2069012
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Cited by 4 scholarly publications.
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KEYWORDS
Plasma

Silicon carbide

Atmospheric plasma

Argon

Chemical species

Fluorine

Ions

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